描述
- VIN (min) : 3.3V
- VIN (max) : 26V
- IntegratedDriver: 1×NMOS
- andCur.Sense: √
- Int’dLDO: √
- Control Interface: I2C/OPTO
- TotalADCchannels: 7
- ADCResolution: 10-bit
- TypicalApplication: Wall adapter, travel adapter
- DPDM: DPDM x 1
- Type-CPortRole: DFP
- PD Version: PD 2.0/ 3.0 + PPS
- ProprietaryProtocol: FC/FCP/AFC/SCP/VOOC
- Protections : OVP/UVP/OCP/SCP/OTP
- GPIOs: 4 GPIOs
- MCU Core: 32-bit
- MemoryType: OTP
- Package: QFN 4×4
Features
USB Type-C
- Supports Type-C Sink protocol
- Configurable Rp resistor
USB Power Delivery
- Supports DFP / UFP / DRP USB PD 3.0
- Hardware BMC transmitter and receiver
- Full-featured Physical Layer (PHY)
- Hardware message detection and automatic GoodCRC reply
- Automatic hardware reset message (Hard Reset) detection
- Integrated PD 3.0 protocol engine
- Integrated VCONN power supporting SOP’ for electronically marked cables
Dual DPDM Fast Charging Interface
- Integrated firmware-controlled DPDM interface
- Supports Apple charging, BC1.2, DCP, HVDCP, FC, AFC, FCP, SCP, and other charging protocols
Power Supply
- Wide operating voltage range: 3.3V to 22V (Tolerant to 26V)
- Integrated programmable feedback compensation
MCU Subsystem
- Integrated 32-bit high-performance MCU core
- 24 k-Byte OTP and 2 k-Byte RAM
- Supports I2C interface and multiple I/Os
- Supports sleep mode
Analog Modules
- Built-in dual DACs for voltage and current regulation
- 10-bit ADC for monitoring voltage, current, and other signals
- Integrated current sense amplifier
- Integrated NMOS gate driver
- Integrated VBUS discharge path on both sides of the isolation MOSFET
- Integrated temperature sensing module
Protection Mechanisms
- Chip provides multiple protection mechanisms: OVP, UVP, OCP, SCP, VCONN OVP, VCONN OCP, VCONN SCP, OTP, DPDM OVP, CC OVP
- VBUS to CC / DPDM short-circuit protection
- GND to CC / DPDM short-circuit protection
Package
- 16-pin QFN 4mm x 4mm x 0.75mm
Applications
- Travel Charger Adapters
