描述

– After adding a converter circuit and a brake circuit to our company’s product “DIPIPM” featuring a built-in inverter circuit and drive circuit, the entire assembly is encapsulated
– Utilizing our company’s unique direct wire bonding technology to achieve compact packaging
-An intelligent power semiconductor module, featuring a built-in BSD with current limiting resistor, various protection functions, analog temperature output function, and a control component with built-in protection function.
-Built-in converter circuit and brake circuit are beneficial for reducing external components and downsizing the inverter
-Simplify the wiring layout of the circuit board to make the inverter system easier to design.
The technology of directly connecting E4IC and IGBT with wires