描述

– Due to the inclusion of RC-IGBT, the footprint is reduced by approximately 53% compared to the compact DIPIPM series
– Transfer molding structure that achieves both heat dissipation and insulation through a high thermal conductivity insulating plate
– Achieving a more compact design than traditional small-sized DIP IPMs, thereby saving space on the inverter circuit board
– Implement the design of the inverter circuit board by equipping with an interlocking function for arm short-circuit protection
The lower limit of continuous operating temperature is -40¡ãC, making it suitable for a wide range of usage environments, including cold regions