描述

– A transfer molding structure that achieves both heat dissipation and insulation through a high thermal conductivity insulating sheet
– Direct control through HVIC equipped with drive circuit, protection circuit, and level conversion circuit, based on input signals from CPU and microcomputer
Using a single power supply and not employing a photoelectric coupler can reduce the size of the circuit board and enhance its reliability
– The product lineup includes a built-in BSD model with a current limiting resistor