描述

Optimizing pin layout aids in circuit board design and helps reduce the installation area, including the space occupied by surrounding components
– Transfer molding structure that achieves both heat dissipation and insulation through high thermal conductivity insulating sheets
-Direct control through the HVIC equipped with drive circuits, protection circuits, and level conversion circuits, based on input signals from the CPU and microcomputer
– By using a single power supply and not employing a photoelectric coupler, the circuit board can be downsized and its reliability can be enhanced
-Built-in BSD, reducing the number of external components