描述
– Supports three-level inverter, reducing power consumption by approximately 30%
Developing new packaging technologies can help reduce inductance and simplify the circuit structure of inverters
-Optimizing IGBT specifications is conducive to the development of new, small and low-inductance packages.
– It features 4in1 / 1in1 / 2in1 structures, which are conducive to reducing the size of the inverter and enhancing design freedom



